notícias da empresa sobre Ventiva says away with fans for thin and light laptops

Startup Ventiva has developed a fan‑free cooling solution for edge‑system semiconductor chips.

Its technology handles processors with up to 40 W TDP while operating nearly silently, covering nearly the full spectrum of consumer and commercial laptops.

Dubbed the Ionic Cooling Engine (ICE), it relies on electrohydrodynamic (EHD) flow. Two compact electrodes — emitter and collector — receive high‑voltage, low‑current power to build a strong electric field. Air molecules (nitrogen, oxygen, argon and trace gases) lose electrons, generating positive ions repelled away from the emitter. A plasma gap comprises a micron‑scale ionization zone beside the emitter and an ion drift zone. Ions travel toward the low‑voltage collector, colliding with neutral air molecules and setting them in motion.

Upon reaching the collector, positive ions reclaim lost electrons. Current flows backward through the power supply, yielding an outflow dominated by neutral air molecules. The solution produces below 15 dBA noise.

Ventiva pairs this hardware with a software‑governed power supply as its ICE9 platform. Intelligent monitoring enables adaptive airflow adjustment. Designers can feed existing fan‑control PWM signals into solid‑state ICE9 units, which convert PWM inputs to drive the airflow speed.

ICE9 pulls heat from system PCBA hardware via heat pipes or vapor chambers to a fin‑style heat sink, dissipating heat outward. Unlike Frore’s surface‑mount air‑jet SSD‑targeted hardware, ICE9 represents a system‑level laptop redesign.

Laptop chassis adopt side‑in / side‑out airflow. The thin‑and‑light internal layout is partitioned: a rear cooling zone housing ICE modules and heat exchanger, a compute zone for PCBA, CPU, DRAM and NAND, plus a battery compartment. Eliminating fans frees up to 20 percent additional motherboard real‑estate, supporting multiple full‑length 2280‑format M.2 drives and larger‑capacity batteries.

Multiple ICE9 units may stack or run in parallel to boost total airflow. Separate airflow paths handle SoC compute cooling via heat exchangers and skin cooling for keyboards, palm rests and base panels.

Formerly Thorn Micro Technologies, Ventiva originated as a Purdue University spin‑out founded circa 2005 by Vishal Singhal and CTO Daniel Schlitz (both no longer with the firm). Carl Schachte serves as chairman, president and CEO. The venture‑backed company has raised roughly $80 million from investors including IAG Capital Partners, DCM Ventures, Foundation Capital, BRC Group Holdings and Renesas Electronics.

Headquartered in Fremont, California with R&D, prototyping and test labs, Ventiva collaborates with AMD, ASUS, Dell and Intel on reference designs. Target use‑cases cover thin‑and‑light laptops, mini‑PCs, edge hardware, consumer electronics, AR/VR and datacenter servers.

Further details are available in Ventiva’s downloadable whitepaper.

Beijing Qianxing Jietong Technology Co., Ltd.
Sandy Yang/Global Strategy Director
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